The EU Commission approves collaborative research and development aid granted by Germany for the transition to 300 mm silicon wafers (Siemens / Motorola)

Tilmans, Madeleine

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1 Jan 1997

The EU Commission approves collaborative research and development aid granted by Germany for the transition to 300 mm silicon wafers (Siemens / Motorola)

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Reference

EU Commission, Siemens / Motorola, 1997, not available

"GERMANY. The Commission approves collaborative research and development aid to Siemens, Motorola and partners for the transition to 300 mm silicon wafers" The Commission has approved the German government’s proposal to give research and development aid for two collaboration

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Author

Madeleine Tilmans
European Commission - DG COMP (Brussels)

Belgium 52 contributions 9633 visits

Quotation

Madeleine Tilmans, The EU Commission approves collaborative research and development aid granted by Germany for the transition to 300 mm silicon wafers (Siemens / Motorola), 1 January 1997, e-Competitions January 1997, Art. N° 39478

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